Moisture Sensitivity of Plastic Packages of IC Devices
Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industri...
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| Other Authors / Creators: | Fan, X.J. editor. Suhir, E. editor. |
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| Other Corporate Authors / Creators: | SpringerLink (Online service) |
| Format: | Electronic eBook |
| Language: | English |
| Edition: | 1st ed. 2010. |
| Imprint: | New York, NY : Springer US : Imprint: Springer, 2010. |
| Series: | Micro- and Opto-Electronic Materials, Structures, and Systems,
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| Subjects: | |
| Online Access: | Available in Springer Engineering eBooks 2010 English/International. |
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