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Three-Dimensional Integrated Circuit Design EDA, Design and Microarchitectures /
Imprint 2010
Subjects: “...Technology and Engineering....”
Available in Springer Engineering eBooks 2010 English/International.
Electronic eBook
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2
Wafer Level 3-D ICs Process Technology
Imprint 2008
Subjects: “...Technology and Engineering....”
Available in Springer Engineering eBooks 2008 English/International.
Electronic eBook
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3
Materials for Information Technology Devices, Interconnects and Packaging /
Imprint 2005
Subjects: “...Technology and Engineering....”
Available in Springer Engineering eBooks 2005 English/International.
Electronic eBook
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