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|a 9781617615450
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|z 9781617613258
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|a (MiAaPQ)EBC3020958
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|a (Au-PeEL)EBL3020958
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|a (OCoLC)833300441
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|a MiAaPQ
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|a TK7871.99.M44 -- C58 2011eb
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|a 621.39/5
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|a Kwon, Min-jun.
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|a CMOS Technology.
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|a Hauppauge :
|b Nova Science Publishers, Incorporated,
|c 2010.
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|c ©2011.
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|a 1 online resource (262 pages)
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|a text
|b txt
|2 rdacontent
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|a computer
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|a online resource
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|a Electrical Engineering Developments
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|a Intro -- CMOS TECHNOLOGY -- CMOS TECHNOLOGY -- LIBRARY OF CONGRESS CATALOGING-IN-PUBLICATION DATA -- CONTENTS -- PREFACE -- Chapter 1 PRINCIPLES, INTEGRATION AND CHALLENGES OF LITHOGRAPHY TECHNOLOGY FOR DEEP NANO-SCALE CMOS PATTERNING -- ABSTRACT -- 1. INTRODUCTION -- 2. EUV TOOL DEVELOPMENT: STATUS AND REQUIREMENTS -- 3. EUV LITHOGRAPHY CHALLENGES -- 3.1. EUV Source Power Requirement -- 3.2. EUV Mask Defect -- 3.3. EUV Mask Inspection -- 4. EUV SOURCE DEVELOPMENT -- 4.1. Gas Discharge Produced Plasma -- 4.2. Laser Produced Plasma -- 5. EUV RESIST DEVELOPMENT -- 6. EUV IMAGING WITH MULTILAYER MIRRORS -- 6.1. EUV Mirror Structure -- 6.2. Flare Impact on EUV Imaging -- 7. EUV PHASE-SHIFTING MASKS -- 8. SUMMARY OF MASK BASED EUV LITHOGRAPHY -- 9. MASKLESS EUV LITHOGRAPHY -- 10. IMAGING THEORY OF PROJECTION LITHOGRAPHY -- 10.1. Basic Principles of Electromagnetic Field and Geometrical Optics -- 10.2. Light Propagation and Spatial Coherence -- 10.3. Spectral Analysis of Image Formation -- 10.4. Oblique Illumination and Partial Coherence -- 10.5. Resolution Enhancement Techniques -- 10.6. DUV Immersion Lithography -- 10.7. Vector Imaging Theory and Polarization -- 10.8. EUV Multilayer Reflective Optics -- 11. MULTIPLE PATTERNING TECHNOLOGIES -- 11.1. Double Patterning -- 11.2. Self-aligned Triple and Quadruple Patterning -- SUMMARY -- REFERENCES -- Chapter 2 VARIABILITY AND RELIABILITY IN ULTRA-SCALED MOS DEVICES: EVALUATION AT THE NANOSCALE AND IMPACT ON DEVICE AND CIRCUIT FUNCTIONALITY -- ABSTRACT -- INTRODUCTION -- NANOSCALE CHARACTERIZATION OF GATE OXIDE RELATED VARIABILITY -- Experimental Set-up and Sample Description -- Physical Characterization -- Electrical Characterization of the as-Grown High-K Stacks -- Charge Trapping after Electrical Stress -- TIME-DEPENDENT VARIABILITY OF DEVICES AND CIRCUITS.
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|a Variability and Aging Experimental Characterization -- SPICE Modelling of the Aging Mechanisms and Montecarlo Simulation of Device Variability -- SPICE Simulations: from Device Time-Dependent Variability to Circuit Reliability -- CONCLUSIONS -- ACKNOWLEDGMENTS -- REFERENCES -- Chapter 3 LINEAR AND NON-LINEAR APPLICATIONS OF CMOS DVCC -- ABSTRACT -- I. INTRODUCTION -- II. SURVEY OF SOME EXISTING DVCC BASED CIRCUITS -- A. Amplifiers -- B. Integrators -- C. Filters with Bi-Linear Transfer Functions -- D. Biquadratic Filters -- E. Sinusoidal Oscillators and Function Generators -- III. PROPOSED CIRCUITS -- A. Linear Equation Solver -- B. Linear Programming Circuit -- C. Quadratic Programming Circuit -- D. Implementation of Logic Gates Using DVCC -- IV. SIMULATION RESULTS -- CONCLUSION -- REFERENCES -- Chapter 4 COMPACT MODELING OF MULTI-GATE MOSFET INCLUDING HOT-CARRIER EFFECTS -- 1. INTRODUCTION -- 2. DEFECTS IN CMOS-BASED DEVICES -- 2.1. Bulk Defects -- 2.1.1. Origin of the problem -- 2.1.2. Characterization methods -- 2.2. Hot Carrier -- 2.2.1. Origin of the problem -- 2.2.2. Device Parameters degradation -- 3. MODELING OF MULTI-GATE MOSFETS INCLUDING HOT-CARRIERS EFFECTS -- 3.1. Hot-Carriers Effects in Subthreshold Regime -- 3.1.1. Surface potential -- 3.1.2. Threshold voltage -- 3.1.3. Subthreshold current -- 3.1.4. Subthreshold swing -- 3.2. Hot-Carriers Effects in Saturation Regime -- 3.2.1. Drain current model -- 3.2.2. Small-signal model parameters -- 4. CONCLUDING REMARKS -- REFERENCES -- Chapter 5 MOSFET MODELING: RELIABILITY AND VALIDATION FOR ANALOG/RF IC DESIGN -- ABSTRACT -- 1. INTRODUCTION -- 2. ANALOG/RF MOSFET MODELS OVERVIEW, ACCURACY REQUIREMENTS AND VALIDATION -- A. RF MOS Transistor Models and Benchmark Testing -- i. RF modelling accuracy requirements -- ii. MOSFET model benchmark testing for analog/RF IC design.
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|a B. PSP: Brief Overview of the New CMC Standard Compact MOS Model [8] -- C. HiSiM and EKV MOSFET models brief overview -- 3. ANALOG/RF MOSFET MODELLING GENERAL APPROACH ANDS CRITICAL PARAMETERS [5] -- 4. MOSFET MODELLING IN RELATION TO ANALOG / RF CIRCUITS CRITICAL PERFORMANCE PARAMETERS ESTIMATION -- 5. SUMMARY -- REFERENCES -- Chapter 6 CATALOG OF VERSATILE QUADRATURE OSCILLATORS USING GROUNDED COMPONENTS -- ABSTRACT -- 1. INTRODUCTION -- 2. AVAILABLE OSCILLATORS -- 3. PROPOSED CIRCUITS -- 3.1. Circuits' Description -- 3.2. Circuit Analysis -- 4. NON IDEALITIES AND PARASITIC STUDY -- 4.1. Non Ideal Analysis -- 4.2. Effect of DVCC Parasitics -- 5. SIMULATION RESULTS -- 5. AN EXTENDED APPLICATION -- CONCLUSION -- REFERENCES -- Chapter7FEEDTHROUGH:ANENERGYEFFICIENTCMOSLOGICFAMILYFORARITHMETICCIRCUITS -- Abstract -- 1.Introduction -- 2.FTLPrincipleofOperation -- 3.CMOS-FTLevaluation -- 3.1.Proposedstructures -- 3.2.AnalysisResultsfortheBasicCells -- 3.3.Applications -- 4.DesignExamples -- 5.SensitivityAnalysis -- 6.RCAImplementation -- 7.Monte-CarloAnalysis -- 8.RCATestChip -- 9.DiscussionandFurtherWork -- 10.Conclusion -- References -- Chapter 8 DISCUSSION ON 1/F NOISE IN CMOS TRANSISTORS: MODELLING-SIMULATION AND MEASUREMENT TECHNIQUES* -- ABSTRACT -- 1.1. INTRODUCTION -- 1.2. FLICKER NOISE MODELLING AND SIMULATION -- 1.2.1. The Empirical and the Typical 1/f Noise Models -- A. Simple empirical model -- B. Number fluctuation model and mobility fluctuation model -- 1.2.2. Combined Models -- 1.2.3. Noise Simulation Using the BSIM MOSFET Model in Software Packages -- Flicker Noise Simulation Models -- Critical Issues on the Unified 1/f Noise Models -- 1.2.4. Impact of Scaling down Technologies on 1/f Noise -- 1.3. NOISE REDUCTION -- 1.3.1. 1/f Noise under Switched Bias Conditions -- Applications of the Switched Bias Technique.
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|a 1.3.2. Available Methods -- B. DC Offset and Drift Reduction Techniques -- C. Reduce the Upconversion of 1/f Noise -- D. Phase-Locked Loop (PLL) -- E. The switched biasing approach -- Cycling between Strong Inversion and Accumulation -- 1.4. MEASUREMENT OF LOW FREQUENCY NOISE IN MOSFETS -- 1.4.1. Low Frequency Noise Measurement Technique under Constant Bias -- 1.4.2. Low-Frequency Noise Measurement Technique under Switched Bias -- REFERENCES -- INDEX.
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|a Description based on publisher supplied metadata and other sources.
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|a Electronic reproduction. Ann Arbor, Michigan : ProQuest Ebook Central, 2022. Available via World Wide Web. Access may be limited to ProQuest Ebook Central affiliated libraries.
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|a Metal oxide semiconductors, Complementary.
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|a Electronic books.
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|i Print version:
|a Kwon, Min-jun
|t CMOS Technology
|d Hauppauge : Nova Science Publishers, Incorporated,c2010
|z 9781617613258
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| 797 |
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|a ProQuest (Firm)
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| 830 |
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|a Electrical Engineering Developments
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|u https://ebookcentral.proquest.com/lib/well/detail.action?docID=3020958
|z Click to View
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